FLIR Lepton Camera Breakout Board is designed for applications where SWaP, cost, and quality are critical.
By using a jumper, the master clock, local power supplies, and power-up sequence components can be bypassed. This easy-to-interface evaluation board provides onboard power supplies, generated from 3V to 5.5V, and a master clock. 10.5mm x 12.7mm x 7.14mm package dimensionsįLIR Lepton Camera Breakout Board v2.0 quickly connects all versions of the FLIR Lepton camera module to common platforms like Raspberry Pi or custom hardware.Using focal plane arrays of either 160x120 or 80圆0 active pixels, Lepton easily integrates into native mobile devices and other electronics as an infrared (IR) sensor or thermal imager. Longwave infrared, 8µm to 14µm spectral range The Lepton® is a radiometric-capable longwave infrared (LWIR) OEM camera module that is smaller than a dime, fits inside a smartphone, and is one-tenth the cost of traditional IR cameras.Uses standard cell phone-compatible power supplies.Increased scene dynamic range of +400☌ (Lepton 3.5 module only).Integrated digital thermal image processing.FLIR Lepton 3.0 and 3.5 Micro Thermal Camera Modules feature low power consumption, unmatched image quality, and simple integration. While the 3.5 offers the same size, it also provides calibrated radiometric output across the entire 19,200 pixel array.
Both modules feature a CCI (I 2C-like) control port and video over SPI video data interface. The 3.0 module is non-radiometric, while the 3.5 module has a radiometric thermal imaging system. The new version has a resolution of 160 x 120 pixels, doubled from the original module. This device contains an updated version of the Lepton. FLIR Lepton 3.0 and 3.5 Micro Thermal Camera Modules offer 160 x 120 active pixels and <50mK thermal sensitivity in a small 11.8mm x 12.7mm x 7.2mm package. Flir also introduced a second generation of the Flir One.
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